Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools across innovative semiconductor connectivity solutions. Support interconnect technologies within an R&D hardware design team.
This Package and PCB Layout Engineer contributes to the Signal Integrity Products business unit. The work includes feasibility assessments, multi-layer substrate layouts, and wafer-level interconnect designs. Collaboration spans signal integrity experts, manufacturing, thermo-mechanical engineering teams, and suppliers.
Key Responsibilities:

Perform package design feasibility assessments for signal integrity experts
Develop multi-layer substrate and carrier layouts
Support 2D, 2.5D, and 3D IC configurations
Develop wafer-level interconnect layouts using redistribution layers
Coordinate designs with manufacturing and thermo-mechanical engineering teams
Requirements:

Bachelor’s degree in engineering, physics, or relevant discipline
Five years of high-speed package or advanced PCB layout experience
Solid knowledge of high-speed layout and electronic design
Advanced knowledge of EDA layout tools
Understanding of RF, analog, and digital circuits
Apply package layout, PCB expertise, and advanced EDA knowledge to high-speed designs at Semtech’s Signal Integrity Products business unit.

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Senior Package and PCB Layout Engineer