Job opportunity
Senior ASIC Hardware Design Engineer
Broadcom Inc.
Lead demanding hardware design at Broadcom, combining advanced SOC knowledge, 2D and 2.5D packaging, and technical team collaboration.
As a Senior Hardware Engineer, you will design, develop, and deliver ultra high-performance electronic products. You may provide technical leadership to a small design team within a culture where one person owns one board. Your work includes large high-powered SOCs, advanced silicon and packaging technologies, high-density signaling, and power and thermal challenges. You will work with interdisciplinary engineers and partner teams on joint development programs.
Key Responsibilities:
Deliver ultra high-performance electronic products
Provide technical leadership to a small design team
Develop hardware using advanced silicon and packaging technologies
Address high-speed and high-density signaling requirements
Collaborate with interdisciplinary and partner engineering teams
Requirements:
Bachelor's degree in electrical engineering
Five or more years of related experience
Knowledge of 2D, 2.5D, and 3D memory packaging
Experience with 112G+ SerDes rates
Experience with 1kW+ PCB power and thermal issues
Shape Broadcom's advanced hardware products through SOC expertise, packaging knowledge, high-speed design, and collaborative technical leadership.
#J-18808-Ljbffr
Apply on source site As a Senior Hardware Engineer, you will design, develop, and deliver ultra high-performance electronic products. You may provide technical leadership to a small design team within a culture where one person owns one board. Your work includes large high-powered SOCs, advanced silicon and packaging technologies, high-density signaling, and power and thermal challenges. You will work with interdisciplinary engineers and partner teams on joint development programs.
Key Responsibilities:
Deliver ultra high-performance electronic products
Provide technical leadership to a small design team
Develop hardware using advanced silicon and packaging technologies
Address high-speed and high-density signaling requirements
Collaborate with interdisciplinary and partner engineering teams
Requirements:
Bachelor's degree in electrical engineering
Five or more years of related experience
Knowledge of 2D, 2.5D, and 3D memory packaging
Experience with 112G+ SerDes rates
Experience with 1kW+ PCB power and thermal issues
Shape Broadcom's advanced hardware products through SOC expertise, packaging knowledge, high-speed design, and collaborative technical leadership.
#J-18808-Ljbffr