Job opportunity
Principal Hardware Engineer
Broadcom Inc.
As a Principal Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start‑up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.
You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, joint development programs may require extensive interaction with partner engineering teams.
Key Qualifications & Experience
Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 3D memories.
Precision scopes, analyzers, development and validation tools.
Power and thermal issues associated with PCBs with 1kW+ footprints.
High‑speed and high‑density signaling with SerDes rates of 112G+.
Demonstrate lifecycle product ownership of complex products, participating in a cross‑functional team from product inception to volume production.
Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
Bachelor's degree in electrical engineering and 12+ years of related experience.
Beneficial Experience
Small team lead or proven technical mentor of high‑speed hardware designers.
Seniority Level
Mid‑Senior level
Employment Type
Full‑time
Job Function
Engineering and Information Technology
Industries
Semiconductor Manufacturing
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Apply on source site You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, joint development programs may require extensive interaction with partner engineering teams.
Key Qualifications & Experience
Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 3D memories.
Precision scopes, analyzers, development and validation tools.
Power and thermal issues associated with PCBs with 1kW+ footprints.
High‑speed and high‑density signaling with SerDes rates of 112G+.
Demonstrate lifecycle product ownership of complex products, participating in a cross‑functional team from product inception to volume production.
Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
Bachelor's degree in electrical engineering and 12+ years of related experience.
Beneficial Experience
Small team lead or proven technical mentor of high‑speed hardware designers.
Seniority Level
Mid‑Senior level
Employment Type
Full‑time
Job Function
Engineering and Information Technology
Industries
Semiconductor Manufacturing
#J-18808-Ljbffr