Job opportunity
Senior 6G RF Packaging Engineer for 2D/3D Integration
Huawei Technologies Co.
Huawei Canada in Ottawa seeks an Engineer to advance wireless technology in a cutting-edge lab. The role emphasizes RF/microwave packaging, interposer design, and 2.5D/3D integration with hands-on lab work and test-vehicle development.
You will collaborate with RFIC, antenna, materials, and manufacturing teams, coordinate VNA and OTA measurements, and contribute to patents and publications while driving cross-disciplinary research in a dynamic environment.
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Apply on source site You will collaborate with RFIC, antenna, materials, and manufacturing teams, coordinate VNA and OTA measurements, and contribute to patents and publications while driving cross-disciplinary research in a dynamic environment.
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