Become the Advanced Packaging Lead at Untether AI, where your expertise will influence AI product development through innovative packaging solutions. Collaborate creatively to enhance reliability and performance.

As the Advanced Packaging Lead at Untether AI, you will interact with engineers and internal teams to craft packaging strategies that support advanced AI products. The role further involves proposal management for supplier partnerships and addressing technical challenges in packaging. Successful candidates will guide long-term technical decisions and boost internal capabilities.

Key Responsibilities:
• Innovate advanced packaging solutions for AI technologies
• Collaborate with internal stakeholders on improvements
• Drive decisions regarding chiplet strategies and interfaces
• Manage external supplier collaborations for solutions
• Lead quality assurance and design integrity assessments

Requirements:
• Expertise in 2.5/3D packaging technologies
• Familiarity with chiplets and interconnect designs
• Background in packaging manufacturing processes
• Skilled in design tools and failure analysis
• Achievements in advanced technology node designs

Join Untether AI to empower the next generation of AI products with your advanced packaging expertise.
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Advanced Packaging Lead Needed at Untether AI