Job opportunity
Lead Hardware Engineer (Ottawa)
Quarry Consulting Inc
Lead Hardware Engineer with 8+ years of direct electronics design experience , including high-speed digital design and
2+ years as a technical lead , is expected, with a bachelor's degree in EE/CE (or equivalent)
Required Qualifications
Experience with
high-speed digital design and multi-layer PCB design, including 25Gbps+ interfaces (e.g., differential pairs, SerDes)
In-depth understanding of the
full hardware product development cycle : requirements, architecture, schematic capture, PCB layout, signal integrity, verification, and manufacturing
Hands-on debugging using scopes,
VNAs,signal generators, and electronic loads;comfortable with optical test sets and GHz+ oscilloscopes
for eye-diagram, phase-noise, and signal-quality analysis
Familiaritywith
ESD, EMI, and RF design considerations
Tools, languages and platforms
Cadence OrCAD (CaptureCIS), Design Entry HDL, MentorGraphics DxDesigner, AltiumDesigner for schematic capture
Agilent ADS, ANSYS HFSS, MATLAB/Simulink, Cadence PSpice, LTspicefor design and simulation
Technologies
High-speeddevices and protocols : DDR3/4/QDR memory interfaces, PCIe Gen4, MIPI, Gigabit Ethernet, USB-C, HDMI, SerDes, JESD204B
Analog/mixed-signal : complexdesigns combining analog,digital, RF, and power; high current/high voltage isolation from low-voltage logic; FPGAs (CPLD, SoC, MPSoC, RFSoC), DSPs, microprocessors
Power : low-power/battery systems and chargers, power sequencing, switch-mode power supply design, timing budget calculations
Compliance and lifecycle : EMI, EMC, ESD, RoHS; component obsolescence and cost-reduction re-design; regulatory approval strategy
#J-18808-Ljbffr
Apply on source site 2+ years as a technical lead , is expected, with a bachelor's degree in EE/CE (or equivalent)
Required Qualifications
Experience with
high-speed digital design and multi-layer PCB design, including 25Gbps+ interfaces (e.g., differential pairs, SerDes)
In-depth understanding of the
full hardware product development cycle : requirements, architecture, schematic capture, PCB layout, signal integrity, verification, and manufacturing
Hands-on debugging using scopes,
VNAs,signal generators, and electronic loads;comfortable with optical test sets and GHz+ oscilloscopes
for eye-diagram, phase-noise, and signal-quality analysis
Familiaritywith
ESD, EMI, and RF design considerations
Tools, languages and platforms
Cadence OrCAD (CaptureCIS), Design Entry HDL, MentorGraphics DxDesigner, AltiumDesigner for schematic capture
Agilent ADS, ANSYS HFSS, MATLAB/Simulink, Cadence PSpice, LTspicefor design and simulation
Technologies
High-speeddevices and protocols : DDR3/4/QDR memory interfaces, PCIe Gen4, MIPI, Gigabit Ethernet, USB-C, HDMI, SerDes, JESD204B
Analog/mixed-signal : complexdesigns combining analog,digital, RF, and power; high current/high voltage isolation from low-voltage logic; FPGAs (CPLD, SoC, MPSoC, RFSoC), DSPs, microprocessors
Power : low-power/battery systems and chargers, power sequencing, switch-mode power supply design, timing budget calculations
Compliance and lifecycle : EMI, EMC, ESD, RoHS; component obsolescence and cost-reduction re-design; regulatory approval strategy
#J-18808-Ljbffr